Soft Electronic Vias and Interconnects Through Rapid Three-Dimensional Assembly of Liquid Metal Microdroplets

Soft Electronic Vias and Interconnects Through Rapid Three-Dimensional Assembly of Liquid Metal Microdroplets

Engineering, Mechanical Engineering, Electrical Engineering, Materials Science, Metallic Materials, Life Sciences, Bioengineering,
soft electronics   liquid metal   3D assembly   vias   interconnects   flexible circuits   photocuring  

Research on Rapid 3D Assembly of Liquid Metal Microdroplets in Flexible Electronics for Electrical Interconnection Introduction: Research Background and Significance As flexible electronics find widespread applications in fields such as soft robotics, wearable electronics, and flexible displays, achieving electrical interconnection across layers of...